Even a small amount trapped within the board can result in damage. What is delamination’s most likely cause? It can happen due to one factor or a combination of several: Moisture Manufacturers must implement correct resin-application techniques to ensure the PCB is produced without measling, as it’ll almost certainly occur later on. However, like delamination, measling can also occur during production. Some measling will likely occur during the board’s life and isn’t normally a source of concern. As long as the measling doesn’t bridge conductors or soldering eyes, your PCB can likely continue normal operation. Fortunately, that’s not necessarily the case with measling. When delamination occurs, the board’s functioning is almost certainly impaired. A lack of resin during production, or excess stress at any point in the PCB life cycle, are the two most common causes. However, if you see white spots, that’s measling. If you see raised blisters on the PCB base materials, that’s delamination, and it’s caused by humidity buildup. If an insufficient amount of resin is applied to the board during the lamination process, white spots on the PCB weave interior will appear. Like delamination, measling also involves problems with the lamination process. However, they have different causes and represent different production problems. Telling the two conditions apart isn’t always easy, as they share many similar symptoms. Difference Between Delamination and MeaslingĪside from delamination, measling is another potential problem. The most effective solutions against delamination are batch testing, high-quality materials, and controlled production methods.
Delamination is almost always the result of issues on the production side. Instead, most anti-delamination efforts focus on prevention. Once delamination begins, a few remedies are possible, but they’re not guaranteed. It has a cumulative effect: As the boards shift position, they put pressure on the already-weak adhesive, resulting in additional separation.
Next, the boards move apart, as they’re no longer bound by adhesive. As the resin loosens and disintegrates, the blisters appear.
During delamination, heat and humidity either loosen the resin from the fiberglass or loosen the resin from the foil or laminate.ĭelamination occurs in two distinct steps. A flame-resistant, epoxy resin binds these FR-4 layers. The base materials typically consist of FR-4, a laminate material made from woven fiberglass. Heating during the production process turns the humidity into a gas, causing blistering and layer movement. They occur if the laminate on the base material is exposed to humidity. The process is easy to identify because the board will have small, visible gaps or bubbles, typically referred to as blisters. It results in the layers of the base material separating from one another.
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